Thermal conductive silicone gasket is a type of thermal conductive medium material synthesized through special processes using silicone as the base material and various auxiliary materials such as metal oxides. It is used to fill gaps to conduct heat and reduce contact thermal resistance, while also having insulation, shock absorption, sealing and other functions. It can meet the design requirements of miniaturization and ultra-thin equipment, and has a wide range of thickness applications. Thermal conductive silicone sheets have a certain degree of flexibility, excellent insulation, compressibility, and natural adhesion on the surface. They are specially designed and produced for using gaps to transfer heat. They can fill gaps, complete heat transfer between the heating and cooling parts, and also play insulation, shock reduction, and other functions. They can meet the design requirements of equipment miniaturization and ultra-thin. They are highly processable and practical, with a wide range of thickness applications. They are an excellent thermal conductive filling material and are widely used in electronic and electrical products. Technical parameters: Density: 1.60-3.6 g/cm ³ Drying time: ≤ 20 minutes, complete curing time at 25 ℃: 3-7 days, elongation at 25 ℃: ≥ 200%, hardness: 8-60 Shore A, peel strength:> 5 N/mm Operating temperature range: -60~280 ℃ Volume resistivity:> 2.0 × 10 ^ 10 Ω/cm ³ Dielectric strength:> 10 KV/mm thermal conductivity coefficient: 2-12W/(m · K) flame retardant: UL94 V-0 Features: 1. The material is relatively soft, with good compression performance, good thermal insulation performance, and a large adjustable range of thickness, suitable for filling cavities. Both sides have natural viscosity, strong operability and maintainability; 2. The main purpose of selecting thermal conductive silicone film is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the radiator component. Thermal conductive silicone film can effectively fill the gap between the contact surfaces; 3. Due to the fact that air is a poor conductor of heat, it can seriously hinder the transfer of heat between the contact surfaces. However, adding thermal conductive silicone sheets between the heat source and the radiator can squeeze the air out of the contact surfaces; 4. The thermal conductivity coefficient of thermal conductive silicon film is adjustable, and the thermal stability is also better; 5. To bridge the process error in the structure of thermal conductive silicone sheets and reduce the process error requirements for radiators and heat dissipation structural components; 6. Thermal conductive silicone sheets have the effect of shock absorption and sound absorption; 7. The thermal conductive silicone sheet has the convenience of installation, testing, and reusability; 8. Meet ROHS. General application: LED lighting products – chassis, frame or other cooling components&# 8211; High speed and large capacity memory; Heat pipe components; Memory module; Motor controller; Communication hardware& Gt; Product features: 1. Soft material, good compression performance, good thermal insulation performance, large thickness range, suitable for filling gaps, natural adhesion on both sides, strong operability and maintainability; 2. It can reduce the contact thermal resistance between the surface of the heat source and the contact surface of the radiator, and can effectively fill the gap between the contact surfaces; 3. Due to the fact that air is a poor conductor of heat, it can seriously hinder the transfer of heat between the contact surfaces. However, adding thermal conductive silicone sheets between the heat source and the radiator can squeeze the air out of the contact surfaces; 4. It can bridge the process tolerances on the structure and reduce the process tolerance requirements for radiators and heat dissipation structural components; 5. It can absorb shock and sound; Product application: 1. Used for control motherboards and motors in electronic and electrical products. 2. Electronic and electrical appliances, automotive machinery, computer hosts, laptops, DVDs, VCDs. 3. Any equipment that requires filling thermal gaps and installing heat dissipation modules. Storage conditions: Best storage conditions: 23 ± 2 ℃, 65 ± 5% RH indoor environment, with a warranty period of 1 year after manufacturing. Specification table: Project unit specification value. Test standard color/light gray visual density g/cm 33.55 ASTM D792 Thermal conductivity coefficient W/m. K3~8 ASTM D5470 Thickness mm 0.5-3.0 ASTM D374 Hardness Shore A65 ASTM D2240 Fire rating/V-0UL94 Volume resistivity Ω. cm ≥ 1.0 × 10 ^ 13 GB/T1410 Temperature resistance ℃ -50~200/breakdown voltage KV ≥ 10 ASTM D149
