Kanglida has advanced die-cutting, bonding, and slitting equipment as well as a thousand level dust-free production workshop, specializing in die-cutting, processing, and sales of various optical films/sheets, protective films, optical tapes, etc. in the electronics industry. At the same time, we specialize in processing and applying specialized tapes, insulation materials, cushioning materials (Poron/EVA/EPDM/NBR/PU Foam, etc.), shielding EMI/EMC/RFI materials, EMI Shielding, Gasket conductive foam, thermal conductivity/heat dissipation materials, and electrical and acoustic accessories such as dust nets. Process Description: Model: PS, 3M, TESA, Nippon Paint, and any other brand of raw materials. Specification and Shape: Customizable machine equipment can be customized according to requirements or drawings. Features: Small hole positioning sleeve punching, high-precision flat die-cutting, multi station circular knife die-cutting. Process Features: Asynchronous die-cutting, seamless splicing of frame glue, and other processes are used to maximize the utilization of raw materials.
