Low temperature hot melt tape: achieving reliable fixation of high-temperature sensitive components in electronic devices

In modern electronic products, many components and materials are highly sensitive to temperature. For example, semiconductor chips, printed circuit boards (PCBs), and other precision components typically cannot withstand high soldering or assembly temperatures. Therefore, in order to ensure the safety and performance of these critical components, special adhesive techniques need to be used for assembly and maintenance. Low temperature hot melt tape, as an innovative solution, provides the possibility of…

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