The sponge in the all-round conductive sponge is produced by the foaming technology of polymer polyurethane composite materials. The foaming pore size is uniform, soft, elastic, and has strong corrosion resistance. The foam has a large amount of elastic change and has good shock resistance. On the basis of the sponge, it is electroplated with conductive metal, and the back of the conductive sponge is made of conductive cloth as the substrate, allowing the conductive adhesive to adhere to the sponge material, thereby achieving all-round conductivity. The all-round conductive sponge is widely used in the gaps of equipment such as chassis and various electronic products for EMI/EMC prevention and control, providing impedance conductive connection and good electromagnetic wave shielding effect, especially suitable for situations with limited capacity and closing pressure, and low cost. It is particularly suitable for use in high-performance shielding situations that require good adhesion. Mainly used in electronic cases, casings, indoor cases, industrial equipment, laptops, mobile communication devices, etc. Properties and Customization: Conductive sponge is not affected by temperature and humidity. The surface resistance value can be customized according to actual use. Density can be customized. Double sided tape or used in conjunction with other substrates. Thickness is optional. Technical parameters:; Vertical resistance: ≤ 1.0 Ω/Sq Shielding effect: 50dB~80dB/10MHz~3GHz Heat resistance temperature: -40 ℃ -120 ℃ Peeling force: ≥ 1.2Kgf/in Fire resistance rating optional: UL94V0.94 (HF-1) Thickness: 0.5~5mm (customizable) Color: Silver gray/black;
