SMT EMI conductive foam is an electromagnetic compatibility (EMC) component that can be used for installation in SMT processes. It is mainly used in the PCB assembly process to provide an effective and stable grounding point, and to provide effective EMI shielding effect. SMT EMI conductive foam can be used for DVRs, cameras, and other small digital products. The main structure of SMT EMI conductive foam is an outer layer of conductive silicone rubber (copper silver plated), an inner layer of silicone rubber elastic core with special opening design, and a bottom of tin plated copper foil. The structure is stable and can be quickly assembled using SMT technology. SMT EMI conductive foam parameters: characteristic number of each material, material name specification, material 1 conductive silicone surface resistance: maximum 0.5 μ m silicone rubber+silver coated copper powder, 2 elastic core heat-resistant and halogen-free silicone rubber, 3 metal foil thickness: 70um tinned copper foil Gore (GORE). This product has been discontinued from external supply. Our product can replace GORE products and has similar compression rates and performance. Gore part number 25SMT-4442-01 REV A thickness (mm) 1.66 length (mm) 3.56 width (mm) 1.79 weight (mm) 0.020 low compression part height (mm) 1.48 DC resistance (ohms) 0.008 reaches compression force (N) 0.9 recommended compression part height (mm) 1.19 DC resistance (ohms) 0.006 reaches compression force (N) 2.3 high compression part height (mm) 0.9 DC resistance (ohms) 0.009 reaches compression force (N) 7.0
